The U.S. Department of Defense today announced the award of $238 million in CHIPS and Science Act funding for eight Microelectronics Commons regional innovation hubs. This is the largest award to date under the act, which was passed in August 2022 and provides roughly $280 billion for research and manufacturing of semiconductors in the United States.

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There’s more to the rise in HPC and AI of domain-specific architectures (DSAs), starting with GPUs, than just the superior throughput they can deliver. Yes, the deceleration of Moore’s Law and Dennard scaling are the primary reasons for the CPU’s decline in dominance. But other factors are playing a strong, enabling role for DSAs. Consulting […]

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Manufacturers are using the power of AI and video analytics to enable better quality control and traceability of quality issues, bringing them one step closer to achieving zero defects and reducing the downstream impacts of poor product quality....

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AMD today announced the AMD Versal Premium VP1902 adaptive system-on-chip (SoC), which the company said is the largest1 adaptive SoC. The processor is an emulation-class, chiplet-based device for streamlining the verification of semiconductor designs. Offering 2X2 the capacity over the prior generation, AMD said designers can innovate and validate application-specific integrated circuits (ASICs) and SoC designs […]

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WASHINGTON, D.C. –The U.S. Department of Energy (DOE) announced a $3.9 million federal investment for 13 projects that will tap into the DOE national laboratories’ HPC resources to connect with industry partners. These short-term, collaborative projects will address manufacturing challenges and are intended to accelerate development of clean energy technologies. Boeing, Ford Motor and General […]

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GE Aerospace has announced that to support the development of a new open fan jet engine architecture, the organization has run simulations using Frontier, the world’s no. 1 ranked supercomputer, housed at the Department of Energy’s Oak Ridge National Laboratory. To model engine performance and noise levels, GE Aerospace created computational fluid dynamics software to run […]

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HSINCHU, Taiwan, R.O.C, Jun. 8, 2023—TSMC (TWSE: 2330, NYSE: TSM) today announced the opening of its Advanced Backend Fab 6, the company’s first all-in-one automated advanced packaging and testing fab to realize 3DFabric integration of front-end to back-end process and testing services. The fab is prepared for mass production of TSMC-SoIC (System on Integrated Chips) […]

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With increased global competition and rising customer expectations, industrial engineers are under incredible pressure to lower their expenses while maintaining quality and performance. To overcome these challenges, they are transforming their workflows by bringing the physical and digital worlds together. Engineering simulation....

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SANTA CLARA, CA, Apr. 26, 2023 – TSMC (TWSE: 2330, NYSE: TSM) showcased its latest technology developments at its 2023 North America Technology Symposium, including progress in 2nm technology and new members of its 3nm technology family. These include N3P, an enhanced 3nm process for better power, performance and density, N3X, a process tailored for […]

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Santa Clara, Calif., and Dresden, Germany, April 25, 2023 – Fraunhofer IIS/EAS, an applied research institute in advanced package solution design, and Achronix Semiconductor Corporation, a supplier of FPGAs and eFPGA IP solutions, announced they are entering today in a partnership to build a heterogeneous chiplet solution to validate performance and interoperability in high-performance system […]

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